Shenzhen Smartechs&Bain Techonology Co., Ltd.

Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max.Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Min.Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size
1150mm × 560mm
Aspect Ratio
18:1
Surface Finish
HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.