Tylon International Limited

Type of assembly: SMD(Surface Mount Device), TH(Through hole), SMD&TH mixed
Solder type: water soluble, solder paste, lead free(RoHS)
Component type: passive part, min size 01005; BGA, UBGA, QFP, QFN, SOP,S SOP, VSO, TOSP, etc. Connectors and terminals.
Bare board size: Min 6.35mm*6.35mm, max 534mm*510mm
Min. IC pitch: 0.3mm
Placement precision: 0.01mm
Testing: X-Ray inspection, AOI, ICT
Component packaging: reel, tape, tube and tray, etc.